ISTA TransPack Forum 2017

Orlando FL

Apr 17 - 21, 2017

The TransPack Forum program provides a balance of valuable presentations, case studies, research and solutions
from world-leading experts on the latest ideas in transport packaging.

The program is designed to create opportunities for attendees to network and gain direct access
with like-minded professionals who are facing the same challenges. You can expect to build new relationships and create resources with people centered on the transport packaging industry.

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Adam Armstrong

Director, Sales and Business Development, Specright Inc

Bio: Education: MBA, UCLA Anderson School of Management; Bachelors in Economics, UCLA.

Adam Gendell

Senior Manager, GreenBlueOrg

Bio: Adam Gendell is the Associate Director of GreenBlue’s flagship project, the Sustainable Packaging Coalition. Adam‘s work with the packaging value chain touches on goal-setting, design considerations, and stakeholder engagement. Adam has developed and delivered training seminars for hundreds of packaging professionals, including the Coalition’s Fall conference SPC Advance. Since joining GreenBlue in 2010 he has brought together stakeholder groups to lead work on topics ranging from life-cycle-oriented design to substantiation data for FTC-compliant recyclability claims. Most recently, Adam spearheaded a collaboration between packaging trade associations, recycling-focused NGOs, and government agencies to conduct a robust nationwide study on consumer access to recycling systems.He coordinates several Industry Leadership Committees and is a frequent speaker and writer on sustainability topics. In 2013 Adam served on the PAC NEXT Leadership Council.

Caitlin Harren

Mgr. Product Management - Sustainability Ops, Amazon.com

Bio: BA, Government and Environmental Science & Policy - Smith College; MS/MBA, Sustainable Enterprise - University of Michigan.

Chandra Arcot

CTO, Axiom Global Headquarters - Bangalore

Bio: Education: Master in Thermal Engineering NIT , Bachelors in Mechanical Engineering. Achievements: Co Founder and Technology Lead at Axiom , Publications in the area of use of Modelling and Simulation for Automotive, Aerospace, Consumer Goods and packaging Verticals.

Changfeng Ge

Professor And Director, Rochester Institute of Technology

Bio: Education: Dr.-Ing. from University of Dortmund- Mechanical Engineering, M.E and B.E. from Tongji University-Mechanical Engineering. Activities: Editor-in-Chief of the Journal of Applied Packaging Research, ASTM D10.13 Chair, Board Member of IAPRI and member of TAPPI.

Dave Leinberger

Senior Manager - Packaging Engineering & Material Handling, ABF Freight

Bio: Education: BS & MS in Packaging - Michigan State University Activities: ISTA Testing Council former chair, ISTA Technical Commitee, ASTM D-10 Committee. Achievements: IoPP CPP-Lifetime, IoPP College of Fellows, ISTA CPLP- Professional, US patent holder.

Dr. S. Paul Singh

President, Packaging Forensics Associates, Inc.

Bio: Education: Ph.D., (Ag. Engg) MS, (Packaging), BS (Honors - Mech Engg). Activities: ASTM, IAPRI, ASSE, ASME, ISTA, IOPP, NIPHLE, ISO, WFLO. Achievements: Military Packaging Hall of Fame, ASTM Award of Merit, Fellow IOPP and ASTM.

Eduardo Molina

Graduate Research Assistant, Virginia Tech

Bio: Education: B.S. in Industrial Engineering from Costa Rica Institute of Technology. Currently finishing an M.S. in Packaging at Virginia Tech and starting with the PhD program. Achievements: ISTA Certified Packaging Laboratory Professional.

Eric Hiser

Vice President - Technical, ISTA

Bio: Michigan State University – Bachelors of Science in Packaging; Member of ASTM International Committee D-10 on Packaging Testing Standards, IoPP Certified Packaging Professional (CPP), and an Active Member of IoPP Transport Packaging Committee.

Eric Joneson

Vice President, Marketing, Lansmont Corporation

Bio: B.S. in Packaging from Michigan State University. Activities: ISTA Global Board of Directors - Past Chair; ISTA Technical Division Board Director; ASTM D10, US Random Vibration Expert for ISO-TC122-SC3-WG7; Editor International Journal of Advanced Packaging Technology (IJAPT); International Association of Packaging Research Institutes (IAPRI). Achievements: ISTA CPLP Professional, numerous technical presentations, publications and training sessions, Transportation packaging expert witness, Distribution measurement and analysis expert.

Florian Dramas

Research and Development Packaging Manager, Materne North America - GoGo squeeZ

Bio: Education: PhD.

Hao Liu

Packaging Engineer Associate, ABF Freight

Bio: Education: Bachelor of Science, Chemistry, 2008, Xiamen University, Xiamen, China; Ph.D. of Chemistry, 2013, University of Florida, Gainsville, FL.; Currently pursuing a Master's in Packaging, Michigan State University. Activities: 6 years as a research assistance and teaching assistant. Achievements: Graduate Student Research Abroad Award.

Kyle Pischel

Technical Director, Atlantic Packaging

Bio: Education: Michigan State University - School of Packaging. Activities: ISTA, ASTM, PMMI.

Laszlo Horvath

Director, Center for Packaging and Unit Load Design, Virginia Tech

Bio: Education: MS in Wood Engineering, MS. in Engineering Management, Ph.D. in Forest Biomaterials. Activities: VP of TAPPI Virginia North Carolina, IoPP premium member, ISTA CPLP Professional. Achievements: Chair of ASTM D1185, Member of ANSI MH1 and MH10.

Marshall White

President, White & Company

Bio: Education: BS in Packaging from Michigan State University. Activities: Vice-Chairman for ASTM subcommittee D10.25 on Palletizing and Unitizing of Loads, member of IoPP's Transport Packaging Committee, contributor to ISTA testing protocols for unitized goods.

Matt Thompson

Executive Director - Packaging Technology, Sealed Air

Bio: Bachelor in Science in Packaging from San Jose State University + 25 years of on-the-job experience at Sealed Air Activities: Current Member of the ISTA Global Board.

Oliver Campbell

Director, Packaging, Dell Technologies

Bio: Education: Education: BS, MEng Engineering, Cornell University; MBA, University of Texas. Achievements: Industry first innovations in bamboo, wheat straw, AirCarbon carbon negative, and Ocean Plastic packaging

Patrick McDavid

Instructor, Michigan State University School of Packaging

Bio: Education: Bachelor of Science, Packaging, 1997, Michigan State University; Master of Science, Supply Chain Management, 2008, Elmhurst College, Elmhurst, IL.; MBA, 2010, Elmhurst College, Elmhurst, IL.; Currently pursuing a Ph.D. in Packaging, Michigan State University. Activities: 18 years of distribution packaging and dynamics experience. Instructor at The Michigan State University School of Packaging. Chair of the ISTA Technical Division Board. ASTM D10 Committee Member. Achievements: Lifetime CPP. CPLP Professional. Crawford Fellowship Award Winner.

Quinto Marini

Package Engineering Manager, UPS Customer Solutions

Bio: Bachelors of Science in Packaging from Michigan State University Activities: ISTA North American Division, Technical Committee, Sustainability; Member of the Sustainable Packaging Coalition Achievements: Two patents in Packaging.

Robby Martin

Sr. Engineering Project Manager, Bush Brothers & Co.

Bio: Education: BS in Industrial Engineering Technology. Activities: PMMI Packaging Managers Council; IOPP member; ISTA member.

Suzanne Fisher

Sr Program Manager, Special Handling Packaging, Amazon

Bio: Education: BS, Packaging - Michigan State University. Achievements: Hall of Fame inductee in Michigan State University’s School of Packaging, a former Member of the Year and College of Fellows member at the Institute of Packaging Professionals, and strong supporter of packaging education.

Tom Feltault

Director DPLS, AAR/TTCI

Bio: Tom is a 1980 graduate of Iowa State University and began his railroad career in 1981 with the AAR Damage Prevention & Freight Claim Section in Chicago. In 1985, he transferred to Pueblo, Colorado to manage the closed car loading test program. In 1998, Tom left the AAR and worked as a consultant in freight loss and damage prevention. Tom returned to the AAR/TTCI as the Senior Manager Damage Prevention Engineering in May of 2011 and currently holds the position of Director DPLS. Tom’s work has been published by an alphabet soup of organizations, including ASTM, ASME, IOPP, CCMTA and others. Tom resides in Pueblo with his wife Johanne. He has 3 children and 6 grandchildren.

Travis Norton

Technical Director, Bureau Veritas Consumer Products Services, Inc.

Bio: Education: State University of New York at Brockport. Activities: Service Development, Supply Chain Risk Management, Standards R&D (ASTM, CGSB, EN, etc). Achievements: Global Quality Program Development for Leading Brands / Retailers, 16 years living outside of USA.

Michael Pagel

Sr. Staff Engineer - Packaging, Kohler Company

Bio: Education: B.S. Packaging, University of Wisconsin – STOUT. Activities: Member of ISTA and IOPP. Achievements: UW – STOUT Packaging Program Advisory Board, Six Sigma Certified, Created a packaging consortium team with outside companies.

Joe Fair

Lexmark

Bio: Education: B.S. in General Science Education from Michigan State University. M.S. in Packaging Engineering from Michigan State University. Activities: Member of ISTA TSG. Achievements: ISTA CPLP Technician and IoPP CPP.

Bernard Michael McGarvey Ph.D.

Senior Engineering Advisor, Eli Lilly and Company

Brianne Pluta

Packaging Engineer, EPE USA

Bryan Douglas Cardis

Consultant Packaging Engineer, Eli Lilly and Company

Carolyn Williamson

Principal Packaging Engineer, Bristol Myers Squibb

Idan Tal

Senior in B.S. Industrial Technology and Packaging, California Polytechnic State University

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