Jobs Posted on the Whova Community Board of IEEE 29th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2022)
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Senior Service Engineer / Service Engineer
Denton Vacuum Singapore Pte Ltd Day to day support to existing customers as well as new customers. Experience in vacuum systems and Ion Beam technique will be an added advantage
Electronics Research Engineer
CIBA Physics NUS A full-time applied research and engineering position is available within Associate Professor Jeroen Anton Van Kan’s multidisciplinary team to develop a Proton Microscope with 3D resolution down to ~10 nm. The goal of this project is a commercial prototype with unique capabilities for the characterisation of nanoscale semiconductor devices manufactured at current or future generation process nodes.
Regional Marketing Manager
Thermo Fisher Scientific The primary responsibility is to drive programs that improve lead generation and growth in the region. They will work in close collaboration with the local Sales, Nanoport, Sales Development, Divisional Marketing and Business Unit marketing teams to deliver sustained regional market growth in Taiwan, SEA and China regions.
Regional Marketing Manager
Thermo Fisher Scientific The primary responsibility is to drive programs that improve lead generation and growth in the region. They will work in close collaboration with the local Sales, Nanoport, Sales Development, Divisional Marketing and Business Unit marketing teams to deliver sustained regional market growth in Japan and Korea.
Regional Marketing Manager
Thermo Fisher Scientific The primary responsibility is to drive programs that improve lead generation and growth in the region. They will work in close collaboration with the local Sales, Nanoport, Sales Development, Divisional Marketing and Business Unit marketing teams to deliver sustained regional market growth in the North America and EMEA regions.
Senior Device Analysis Engineer
AMD • The position focuses on the device analysis of advanced microprocessors and graphics processors based on 5nm, 3nm and below technologies. • Perform comprehensive failure analysis including transistor nano-probing, electrical characterization using AFM, Electron Microscopy and Material Analysis. • Develop advanced FA techniques to tackle latest FINFET technology and Multicore products. • Explore use of Machine learning / AI for Device Analysis applications. • Work in deep collaboration with AMD World-wide Design, Product, Reliability and Foundry Engineering teams to resolve complex new product bring-up, yield and reliability issues. • Work closely with Scientific Instruments manufacturers, Universities and Research Institutes to develop new and innovative failure analysis tools and techniques. • Develop technical roadmap to tackle advancing process technology nodes.
Requirements: • B.Eng, M.Eng in Electrical Engineering, Microelectronics, Materials Engineering and related fields. • Able to work in 5 days-a-week evening shift (1.30pm – 11pm). Attractive allowance provided. • Candidate should possess a fundamental understanding of device physics. • A strong background in semiconductor wafer processing and materials characterization is preferred. • An ability to perform basic tool troubleshooting and interact with vendor to resolve tool issues. • Able to work with cross-department and global teams. • Candidates with experience in fabless and wafer fabs are highly preferred.
Engineer/Senior Product Development Engineer (Device Analysis)
AMD - Perform Silicon Debug, Fault Isolation and DFT diagnostics on Advanced Graphics and Microprocessors using state of the art Tester, Diagnostics, Simulation, CAD and Design/Electrical analysis tools. - Close collaboration with Design and Product Engineering groups to resolve first silicon, product qualification and yield improvement failures leading to silicon/process/test flow improvement - Work closely with Scientific Instruments manufacturers, Universities and Research Institutes to develop new and innovative failure analysis tools and techniques - Explore use of Machine learning / AI for Device Analysis applications - Master’s / Bachelor Degree in Electrical/Electronics engineering with 0-3 years of experience in Failure Analysis, IC Design, Product/Test Engineering - Experience with ATE, system, or bench top characterization and debug environment - Applicant must have functional knowledge of transistor device physics, circuit analysis, analytical techniques, CMOS manufacturing processes - Able to work 5 day a week afternoon shift (1.30pm - 11pm) with attractive shift allowance provided.
Product Development Engineer, Device Analysis
AMD THE ROLE: Pursue a challenging and fulfilling career in a fast paced, technological bleeding edge lab environment working on failure analysis and characterization of advanced semiconductor products, packaging and materials.
THE PERSON: Strong problem-solving ability. Able to excel independently yet work savvily in a team. Resilient, organized, attentive to details and able to work under pressure and tight timeline. Good interpersonal and communication (written/spoken) skills.
KEY RESPONSIBILITIES: • Device Analysis of Microprocessors / Graphics modules / memory components (Package level) to enable new Product Development, Qualification and Introduction • Operate advanced analytical tools to perform Fault Isolation, Non-Destructive Testing and Destructive Physical Failure Analysis (Cross-section, Parallel Lapping) • Report writing to collate and present concise analysis data/findings • Collaboration with internal customers and cross-functional engineering/quality teams for root cause debug and resolve various product issues. • Collaborate with vendors and research institutes to lead technical/evaluation projects to improve or develop new device analysis techniques • Authorship in renowned International Technical Conferences (e.g. IPFA, EPTC, ISTFA ) • Analytical tools ownership • Undertake Lab and strategic administrative duties • Must be willing to work evening shift (1.30pm - 11pm) after training phase. Attractive shift allowance.
PREFERRED EXPERIENCE: • Internship or work experience in similar lab environment • Comfortable working with Xray, chemicals and liquid nitrogen • Experience in Xray, SEM, EDX, FIB, SAM, IR-LIT, Sample preparation preferred • Knowledge in Semiconductor IC device analysis, Flip-chip assembly and reliability testing
ACADEMIC CREDENTIALS: • Bachelor/Masters in Materials / Electrical / Microelectronics Engineering preferred • Fresh graduates are welcomed to apply
Member of Technical Staff: IC Design
Globalfoundries Responsibilities: •Digital / Analog design and layout analysis •Simulation and debug on circuit design •To study and be proficient in PDK (process design kit), tech files and other design collaterals for advanced technology nodes •To work closely with product engineers and failure analysis team to investigate and resolve yield issues through Circuit/Layout Design Diagnosis •To lead a team to achieve the best-in-class root cause finding for Fab low yield issue, Yield improvement for yield ramp, RMA/Customer return •To evaluate and enhance the capabilities of Circuit/Layout Design diagnosis
Required Qualification: •Master’s degree or Ph.d in Electrical Electronic Engineering Engineering or relevant engineering discipline with circuit design experience in Digital/Analog/Memory/DFT. Good to have experience in RF or Mixed signal. •Familiar with Circuit Design and Layout related EDA tools (Virtuoso, Calibre, Layout editor, Avalon…) •Familiar with Electrical parameters, IC testing, Fault diagnosis/Failure analysis techniques •Semiconductor processing experience/understanding •Excellent data analysis and problem-solving skills •Strong interpersonal skills and ability to work effectively within a cross functional team environment.