Process Engineer
PacTech - Packaging Technologies GmbH
Join our team of wafer level packaging experts and grow with us! We are looking for junior and experienced engineers to join the expansion in Penang as well as other sites in Germany and USA
Link:
pactech.com
Quality Engineer
PacTech - Packaging Technologies GmbH
Join our team of wafer level packaging experts and grow with us! We are looking for junior and experienced engineers to join the expansion in Penang as well as other sites in Germany and USA
Link:
www.pactech.com
Project Management
STMicroelectronics
NPI Project Management
Link:
None
WB Engineer
STMicroelectronics
NPI WB Engineer
Expert in Au, Pure Ag, Ag Alloy & Cu Wire
Experience in ASM & KNS
Link:
None
Wire Bond Process Development Engineer
NXP Semiconductors
Opportunity for Wire Bond Process Development and New Package Development Engineer.
Package Thermal and Mechanical Simulation Expert
Wolfspeed Malaysia
Experience in Ansys/ Solidworks/ Abaqus / Floterm ..etc..software to run package simulation.
Feel free to contact me. Thanks.
Link:
https://cree.wd5.myworkdayjobs.com/en-US/EXT/job/RF-Packaging-Engineer_21-729?locations=090ec5e4b087019c5bda42173c328f08
Product Engineers
STMicroelectroncis Sdn. Bhd.
Yield sustaining to liaise with test plants' engineers on testing issue, the Engineer must ensure smooth production with high Yield and throughput. • Tester conversion to convert test program from old platform to new platform. • To drive improvement activities/project : yield improvement, test time reduction, QA in-line as well as process optimization. • Test Program Debugging - Responsible for on-site support / management in case of Yield or quality problems to achieve a fast problem solving. • Product Transfer/qualification: Managing product transfer to ensure transfer complete in targeted timeline and meeting division requirement. He is also the interface between Division Product Engineering, Planning and Internal MFG teams or OSATs. • Hold lots management To reduce the hold rate and cycle time. To review lot disposition with quality and product engineer. To support division with technical analysis.
Link:
www.st.com
IT Support Engineering
STMicroelectronics Sdn.Bhd.
As part of DTIT (Digital Transformation & Information Technology) organization, the role is to support, improve and deploy Manufacturing Applications. • Incidents support: • To resolve incidents reported by users by analyzing/debugging the business cases versus application behavior, whenever necessary, to design, develop and deploy workaround in order to resume production activities, which required standby support. • Able to work odd office hours for standby / on call support 24 hours x 7 days. • Able to work under stress, in view of AUTOMOTIVE plant, running 24 hours non-stop production, do not allow single interruption to production, towards zero ITP. • Software bugs need to be followed closely with level 2, or even level 3, required to work throughout long hours of working time until the issue was resolved if it is an urgent issue, in which blocking production outputs. • With the high complexity system running integrated with machines, it needs to have good system monitoring, and need to interact closely with Infra team, ensure system are always in healthy mode. • Sometimes, due to urgency of the adhoc request from the site, specific task assigned need to be accomplished within the given time frame, no delay is allowed or tolerate. • Change support: to collect and analyze user requirements and work with business users for existing application enhancement and to handle application qualification (VTP) and user acceptance test (UAT) of new applications release or even new applications • To participate in the master release release to production, working closely with central DTIT support teams (level 3), ensure no issue for the software new release or patches deployed according to planned. • Analyze data for Incident, Problem and Change and rollup of the outstanding changes, Incidents and Problems at the site level
Link:
www.st.com
Assembly Process Engineer - Laser
STMicroelectronics Sdn.Bhd.
To setup Assembly Laser Structuring/Laser Cut Process.. To develop and to industrialize assembly Laser Structuring/Laser Cut process process for new packages, introduce materials to meet the quality, yield, and mission of new application.. To support assembly of engineering sample for new packages or new technologies.. To characterize assemble Laser Structuring/Laser Cut process and materials.. To generate and update process specifications, SOP, FMEA and process control plan To provide technical support when there are critical quality concerns related to assembly Laser Structuring/Laser Cut material / process. Profile. More than 3 years working experience.. Masters/Bachelor's Degree in Engineering (Mechanical / Electrical / Electronics / Microelectronics / Mechatronics / Semiconductor Technology, Material science) or equivalent.. Equipped with statistical data analysis, analytical and problem-solving skills especially at assembly EOL process.. Systematic Problem-Solving methodology e.g., 8D, DMAIC, Process Mapping, Fish Bond, Is/is not…etc.. Ability to anticipate issues and challenges and resolving them quickly. Good knowledge and skills in production area.. Practice high performance behavior and together work as Team in executing projects & strive for excellent
Link:
www.st.com
NPI EOL Engineer
STMicroelectronics Sdn.Bhd.
To develop and to industrialize New material/ New process (Molding/ Package Sawing/ Trim & Form) for new package (eg: QFPs/ Power SSO/ Power SO/ HiQuad/ SOIC/ BGA/ QFN) • To support Qualification lot and Engineering sample to meet time-to market for New packages/ New products • To review and update process specification, FMEA, OCAP and Process Control Plan. • To provide technical support when there is critical quality concern related to EOL material process Profile Skills / Requirements: • Master's or Bachelor's Degree in Mechanical Engineering / Material Science / Electrical Engineering / Electronics Engineering or Equivalent Engineering field. • Minimum 2-3 years of working experience on EOL processes. Experience on BGA packages will be added advantage. • Skill in Design of Experiment (DOE) in SAS-JMP will be added advantage. • Skill in analytical trouble shooting. • Strong technical knowledge on process and material know-how. • Good inter-personal skills and able to work well under pressure
Link:
www.st.com
Site Information Security Officer
STMicroelectronics Sdn.Bhd.
As site information security officer managing plant related cyber security matters. • Implements security improvements by assessing site situation; evaluating trends; anticipating requirements; conducting awareness programs; coordinating central cyber security projects and activities. • Maintains quality service by following organization standards. • Improving plant cyber security maturity level by following cyber security improvement programs, standards and specifications. • Keeps users informed by preparing performance reports; communicating system status, updating specifications and requirements. • Determines and review security violations and inefficiencies by conducting periodic audits, assessment and corrective action. • Regular update cyber security posture to site management • Maintains up to date cyber security related technical knowledge.
Link:
www.st.com
